FIELD: chemistry.
SUBSTANCE: compound contains the following in pts.wt: organosilicon compound-modified epoxy resin in furylglycidyl ether SEDM-3R 100, hardener - product of reaction of formaldehyde and phenol with diethylene triamine aromatic diamine UD-583D 19-23 and filler - boron nitride (BN) with particles having an anisometric shape 30-65.
EFFECT: invention increases strength of the glue joint and its resistance to multiple thermal shocks.
2 tbl, 23 ex
Title | Year | Author | Number |
---|---|---|---|
GLUE EPOXIDE COMPOSITION | 2004 |
|
RU2269561C1 |
ELECTROCONDUCTIVE ADHESIVE | 2011 |
|
RU2466168C1 |
HEAT RESISTANT ADHESIVE COMPOSITION | 1992 |
|
RU2061727C1 |
HEAT-STABLE GLUE COMPOSITION | 1991 |
|
RU2021314C1 |
EPOXYPOLYURETHANE GLUEING COMPOSITION | 0 |
|
SU1835424A1 |
ADHESIVE COMPOSITION | 2011 |
|
RU2468055C1 |
ADHESIVE COMPOSITION OF COLD HARDENING | 2013 |
|
RU2527787C1 |
OPTICAL GLUE | 1989 |
|
SU1665685A1 |
GLUE COMPOSITION FOR TENSORESISTOR GLUEING | 1990 |
|
RU1818832C |
EPOXY COMPOSITION | 1991 |
|
RU2016013C1 |
Authors
Dates
2012-07-27—Published
2011-02-16—Filed