NON-ELECTROLYTIC FLOW METHOD OF METALLISATION OF SUBSTRATES BY SPUTTERING WITH PRELIMINARY SURFACE PROCESSING AND DEVICE FOR ITS REALISATION Russian patent published in 2014 - IPC C23C18/31 C23C18/54 C23C28/02 B05D3/00 B05D1/00 C03C17/06 H05K3/00 

Abstract RU 2532796 C2

FIELD: chemistry.

SUBSTANCE: method contains the following stages: a) physical processing to reduce the surface tension of a substrate before metallisation; b) non-electrolytic metallisation of the substrate surface, processed at stage a) by sputtering one or several redox solutions in the form of aerosol(s), and c) production of a decorative layer on the metallised surface. A device contains a module of physical processing, selected from the following types of processing: processing by flame, processing by crown discharge, processing by plasma and their combinations, to reduce the surface tension, a module of non-electric metallisation and a module of a decorative layer production. The claimed method is used to obtain such products as: vials from hollow glass, in particular, for cosmetic purposes, automobile components, components for household electronics or for the application in aviation, or components for electronics in the form of an electricity-conducting path, antennas of radio-frequency identification or a component with an electromagnetic coating for screening.

EFFECT: invention makes it possible to process a lot of substrates, provides quality adhesion of layers and makes it possible to obtain decorative coatings.

10 cl, 4 dwg, 4 ex

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RU 2 532 796 C2

Authors

Stremsderfer,Samjuehl'

Dates

2014-11-10Published

2009-07-30Filed