FIELD: chemistry.
SUBSTANCE: invention relates to polymer chemistry and specifically to adhesive compositions based on a copolymer of butyl methacrylate and methacrylic acid, used for bonding different substrates (metal, wood, ceramic etc.). The adhesive composition contains (pts.wt) 20.0-30.0 copolymer of 95 wt % butyl methacrylate with 5 wt % methacrylic acid (BMK-5); 3.0-10.0 organic silane of formula (C2H5O)4-n-Si-[OSi(OC2H5)3]n, where n=0-2; 0.5-3.0 water; 2.0-10.0 aerosil and an organic solvent - 46.99-67.5.
EFFECT: use of the organic silane of given formula and water in the adhesive composition increases adhesive strength and heat resistance of the adhesive composition based on the BMK-5 copolymer.
2 tbl, 17 ex
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Authors
Dates
2015-06-10—Published
2013-10-18—Filed