FIELD: chemistry.
SUBSTANCE: reinforced epoxide adhesive composition includes a liquid epoxy diane resin with 20.0-22.5% epoxy groups, dicyandiamide and additionally contains a product of polycondensation of phenylol propane with 4,4'-dichlorodiphenylsulphone, filler in the form of hollow glass microspheres with a bulk density of 250.0-300.0 kg/m3 and quartz fabric.
EFFECT: wide range and enabling variation of dielectric properties, use in modern wideband multilayer radio engineering structures.
2 cl, 2 tbl, 6 ex
Title | Year | Author | Number |
---|---|---|---|
EPOXIDE GLUE COMPOSITION, PREPREG BASED THEREON, AND PRODUCT MANUFACTURED THEREFROM | 2003 |
|
RU2230764C1 |
PHOTOPOLYMERISABLE COMPOSITION FOR PROTECTIVE COATINGS | 2015 |
|
RU2592597C1 |
COMPOSITION FOR HEAT-SHIELDING COATING | 1992 |
|
RU2043378C1 |
COMPOUND FOR DIELECTRIC POLYMER COMPOSITION | 2016 |
|
RU2619103C1 |
EPOXY BINDING AGENT, PREPREG BASED THEREOF AND THEREOF-MADE PRODUCT | 2014 |
|
RU2560421C1 |
PREPREG BASED ON ADHESIVE BINDER OF REDUCED FLAMMABILITY AND FIBERGLASS, CARBON FIBER ON ITS BASIS | 2018 |
|
RU2676634C1 |
POLYMER COMPOSITION FOR MANUFACTURING HONEYCOMB PANELS | 2016 |
|
RU2661575C1 |
COMPOSITION FOR HEAT-RESISTANT DIELECTRIC POLYMER COMPOSITION | 2017 |
|
RU2670840C1 |
HIGH-STRENGTH EPOXY FILM ADHESIVE | 2015 |
|
RU2597912C1 |
GLUE COMPOSITION | 2005 |
|
RU2285027C1 |
Authors
Dates
2015-09-10—Published
2014-07-08—Filed