FIELD: chemistry.
SUBSTANCE: reinforced epoxide adhesive composition includes a liquid epoxy diane resin with 20.0-22.5% epoxy groups, dicyandiamide and additionally contains a product of polycondensation of phenylol propane with 4,4'-dichlorodiphenylsulphone, filler in the form of hollow glass microspheres with a bulk density of 250.0-300.0 kg/m3 and quartz fabric.
EFFECT: wide range and enabling variation of dielectric properties, use in modern wideband multilayer radio engineering structures.
2 cl, 2 tbl, 6 ex
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|
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| GLUE COMPOSITION | 2005 |
|
RU2285027C1 |
| HIGH-STRENGTH EPOXY FILM ADHESIVE | 2015 |
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Authors
Dates
2015-09-10—Published
2014-07-08—Filed