FIELD: chemistry.
SUBSTANCE: invention relates to high-strength epoxy adhesives with high heat resistance of structural purpose. Epoxy adhesive composition for jointing metals and/or PCM contains an epoxy base and a curing agent. As the epoxy base it contains a mixture of epoxy diane resin with one or more epoxy resins selected from a group of N,N-tetraglycidyl derivative of 3,3′-dichloro-4,4′-diaminodiphenylmethane, triglycidyl derivative of paraaminophenol. As the curing agent there is dicyandiamide containing carbon nanotubes of “Taunit-M” type. Composition additionally contains a modifier - polyether sulphone or its mixture with one of poly-aryl sulfones with terminal hydroxyls. Composition includes the following ratio of components, wt%: mixture of epoxy diane resin with one or more epoxy resins selected from a group of N,N-tetraglycidyl derivative of 3,3′-dichloro-4,4′-diaminodiphenylmethane, triglycidyl derivative of paraaminophenol: 63-70, dicyandiamide having carbon nanotubes - 8-10, polyether sulphone or its mixture with one of poly-aryl sulfones: 20-29.
EFFECT: technical result achieved with the composition under the invention is the possibility of creation of adhesive compounds and articles from PCM with stable high strength characteristics, both at room temperature and at the temperature of 180 °C.
4 cl, 2 tbl, 5 ex
| Title | Year | Author | Number |
|---|---|---|---|
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