FIELD: chemistry.
SUBSTANCE: composition comprises bisphenol epoxy resin, polyethylene polyamine is used as a curing agent, and glass hollow microspheres and gallium oxide are used as a filler.
EFFECT: improving the dielectric characteristics of the composition and decrease of the dielectric loss.
1 tbl, 4 ex
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Authors
Dates
2017-05-12—Published
2016-06-21—Filed