FIELD: heating.
SUBSTANCE: in method of heat removal from the heat-emitting electronic components a thermoelectric device is used, consisting of a thermal module adjacent with cold junctions to the electronic component, and the hot junctions of the thermal module are the tunnel diodes designed to convert the heat energy received from the cold junctions in the form of an electric current to the electromagnetic energy which removes heat from the cooling device to the environment.
EFFECT: use of the present method of heat removal enables to improve the heat transfer efficiency and to reduce the size of the heat sink, and thus also to increase the intensity of operation of the cooling systems.
1 dwg
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