FIELD: cooling.
SUBSTANCE: invention relates to cooling and heat removal systems, in particular to devices for cooling of computer processors. Thin-film thermoelectric device with balanced electric-physical parameters of p-and n-semiconductor branches is made in form of thermoelectric device, wherein p-and n-type semiconductors are made in form of parallelepipeds with different geometric dimensions, and thermal module is made in form of thin film on the reverse side of CPU crystal for intensification of heat transfer through substrate on heat sink, resulting in Joule heat releases become almost negligible, as well as identity of resistance of semiconductor branches is achieved.
EFFECT: high efficiency of cooling system.
1 cl, 1 dwg
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