METHOD OF HEAT REMOVAL FROM HEAT DISSIPATING ELECTRONIC COMPONENTS ON BASIS OF USE OF SEMICONDUCTOR LASERS Russian patent published in 2015 - IPC G06F1/20 

FIELD: heating.

SUBSTANCE: invention is used for cooling and the heat removal, for example for cooling of the computer hardware components. The essence of the invention consists in that the method of heat removal from the heat dissipating electronic components on the basis of use of semiconductor lasers consists in use of the thermal module adjoining by cold junctions to the electronic component, and hot junctions of the thermal module are the array of semiconductor lasers intended for conversion of thermal energy from cold junctions in the form of electric current, into the energy of electromagnetic radiation in optical range which removes the heat from the cooled device into ambient air.

EFFECT: possibility of improvement of heat transfer efficiency, reduction of dimensions of the heat removal, increase of intensity of operation of cooling systems.

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