FIELD: process engineering.
SUBSTANCE: invention relates to cards, particularly, to card substrates to be laminated (for example, smart-cards, ID cards, credit cards, and the like) and to fabrication of such substrates to be laminated. This substrate comprises electronic element or non-electronic element, lower cover sheet, upper cover sheet and ply of polymer of thermosetting material between upper and lower cover sheets. Substrate to be laminated can be used in production of cards with the help of usual equipment for application of upper and lower plies thereon.
EFFECT: standard substrate for production of electronic cards wherein printed overlays and laminates can be applied on this substrate.
4 cl, 8 dwg
