FIELD: chemistry.
SUBSTANCE: invention relates to epoxy glue binding agents for connection of polymer compositional materials (PCM) by method of gluing, applied in production of components and assembly units of aircraft, including cases when gluing and moulding of PCM products is realized in one technological cycle. Epoxy glue binding agent includes, wt %: epoxy polyfunctional resin 10.0-40.0; resorcin diglycidyl ether 5.0-50.0; 4,4'-diaminodiphenylsulphone 20.0-28.7; polyethersulphone 3.0-15.0; polyarylsulphone 5.0-25.0 and epoxyurethane resin 2.0-15.0; with molar ratio of reaction groups of epoxyurethane resin OH:NCO constituting from 1.0:0.5 to 1.0:1.0. Epoxy glue composition can also additionally contain dye in quantity 0.01-0.50 wt % of the entire binding agent.
EFFECT: invention makes it possible to obtain binding agent with high level of strength and thermo-mechanical characteristics, as well as resistance to heat and humidity aging, ability to save its own thermo-mechanical characteristics after 30-day heat and humidity aging.
4 cl, 3 tbl
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Authors
Dates
2016-01-10—Published
2014-11-20—Filed