FIELD: chemistry.
SUBSTANCE: claimed invention relates to epoxy resins. Described is non-cured resin, used for preparation of non-cured composite material, containing: epoxy resin component, which contains tri-functional epoxy resin and/or tetra-functional epoxy resin, thermoplastic component, selected from the group, consisting of polyethersulphone, polyetherimide, polysulphone, polyamidimide and polyamide; and curing agent, mainly consisting of 4,4'-bis(p-aminophenoxy)biphenyl and/or its isomers. Also described is non-cured composite material for manufacturing composite component, containing said non-cured resin. Described is method for manufacturing prepreg, including the following stages: provision of non-cured resin, containing epoxy resin component, containing tri-functional epoxy resin and/or tetra-functional epoxy resin, thermoplastic component, selected from the group, consisting of polyethersulphone, polyetherimide, polysulphone, polyamidimide and polyamide; curing agent, mainly consisting of 4,4'-bis(p-aminophenoxy)biphenyl and/or its isomers; and combination of said non-cured resin with reinforcing fibrous filling agent with obtaining said prepreg. Described is method for manufacturing composite component with application of non-cured resin, containing epoxy resin component and thermoplastic component, characterised by the fact that in order to increase resistance of said composite component to action of solvents non-cured resin is cured by means of 4,4'-bis(p-aminophenoxy)biphenyl and/or its isomers.
EFFECT: obtaining resin with increased toughness and increased resistance of cured resin to action of solvents.
18 cl, 2 dwg, 7 tbl, 4 ex
