FIELD: lighting.
SUBSTANCE: invention relates to methods for production of boards for LED light sources. Disclosed method of making boards (150) with inter-component compounds, containing conducting structure to ensure electric circuit, at least one component (114) at its installation on board with components, comprises steps of: providing on conducting plate (100) first predetermined pattern (115), providing on sheet (112) flow resist second predetermined pattern to form areas (125) solder board with components, forming a preliminary assembly (120) by layering sheet resist flow over conductive sheet, applying solder on preliminary assembly, placing least one component for preliminary assembly, performing soldering and layering preliminary assembly onto substrate (130).
EFFECT: high efficiency of using materials and increased rate of production of boards.
11 cl, 4 dwg
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