FIELD: electrical equipment.
SUBSTANCE: field of application: electrical equipment. Device comprises: a base substrate and a substrate for components on which at least two electronic components are located. There is at least one hole extending through the entire thickness of the substrate for the components. At least one hole is made in the gap between at least two electronic components. Substrate for components is connected to the main substrate using a soldered connection. Each of the at least two electronic components can comprise a light-emitting diode element. Also disclosed is method of device manufacturing.
EFFECT: technical result is providing optimum electrical and thermal connection of electronic components.
15 cl, 6 dwg
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