FIELD: instrument engineering.
SUBSTANCE: use: to create a multi-layer body assembly. Essence of the invention consists in the fact that the body assembly of the integrated circuit (IC) comprises a first layer, having a first side and a second side opposite the first side; a second layer joined to the first side of the first layer; one or more antenna elements connected to the second layer; and a third layer connected to the second side of the first layer, wherein the first layer is a reinforcing layer having a tensile modulus greater than the tensile modulus of the second layer and the third layer, the first layer forming a plane extending in the horizontal direction; and no metallic elements for routing electrical signals in the horizontal direction are located directly on the first layer.
EFFECT: technical result is to provide the possibility of reducing losses in conductors.
19 cl, 9 dwg
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