METHOD OF PRINTED CIRCUIT BOARD FILLED TRANSITION METALLIZED HOLES PRODUCING Russian patent published in 2017 - IPC H05K3/42 H05K3/46 

FIELD: manufacturing technology.

SUBSTANCE: invention is intended for designing and manufacturing of multilayer printed circuit boards (PCB) for high-density mounting of surface-mounted components (SMC) with matrix arrangement of terminals in BGA and CGA type housings. In PCB design filled transition metal-coated through holes (MTH) are employed, which enables to achieve uniform application of protective soldering mask and avoid problems with holes metal coating violation due to complexity of chemical agents removal, falling in process of printed unit manufacturing and installation. Filling of transient MTH of SMC seat with matrix arrangement of terminals allows to combine mounting contact pads with transition holes contact pads, thereby increasing conductive pattern arrangement density for creation of space-rocket equipment highly integrated electronics.

EFFECT: providing PCB reliability with increasing printed wiring density due to solder drift prevention into electronic component base seat transition holes with high density outputs matrix arrangement.

3 cl, 4 dwg