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2 591 900

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C2

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IPC

C22C5/04(2006-01-01)

B23K35/26(2006-01-01)

(21) (22)

Application

2014130543/02, 2014-07-23

(24)

Start date

2014-07-23

(22)

Actual filing date

2014-07-23

(45)

Published

2016-07-20

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Inventor

Dovzhenko Nikolaj NikolaevichSidelnikov Sergej BorisovichBelyaev Sergej VladimirovichUskov Igor VasilevichStolyarov Aleksandr ValentinovichRudnitskij Edvard AnatolevichLopatina Ekaterina SergeevnaDitkovskaya Yuliya DmitrievnaUskov Danil Igorevich

(73)

Holder

Federalnoe Gosudarstvennoe Avtonomnoe Obrazovatelnoe Uchrezhdenie Vysshego Obrazovaniya Federalnyj Universitet"

SOLDER ALLOY BASED ON PALLADIUM 850 SAMPLE Russian patent published in 2016 - IPC C22C5/04 B23K35/26 

Abstract RU 2591900 C2

FIELD: metallurgy.

SUBSTANCE: invention can be used in making of jewellery from alloys of Palladium 850 with the help of soldering. Solder alloy based on Palladium 850 contains the following component ratio, wt%: Palladium 85.0-85.5, copper 11.0-12.0, boron 3.4-3.6.

EFFECT: alloy has a low melting point and good flowability on the soldered surfaces.

1 cl, 2 tbl

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RU 2 591 900 C2

Authors

Dovzhenko Nikolaj Nikolaevich

Sidelnikov Sergej Borisovich

Belyaev Sergej Vladimirovich

Uskov Igor Vasilevich

Stolyarov Aleksandr Valentinovich

Rudnitskij Edvard Anatolevich

Lopatina Ekaterina Sergeevna

Ditkovskaya Yuliya Dmitrievna

Uskov Danil Igorevich

Dates

2016-07-20—Published

2014-07-23—Filed

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