FIELD: metallurgy.
SUBSTANCE: invention can be used for soldering and tin-plating of parts in jewellery industry, electronics, electrical engineering and instrument engineering. Solder contains the following component ratio, wt %: silver 64.5-65.5; copper 19.5-20.5; indium 3-5; zinc is the rest.
EFFECT: additional introduction of indium to solder alloy on the basis of silver, which contains copper and zinc, decreases melt temperature, increases fluidity and ductility of solder, which allows enlarging technological capabilities of application of that solder.
1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| SOLDER ALLOYS ON BASIS OF SILVER | 2008 |
|
RU2367553C1 |
| SOLDER ALLOY ON BASIS OF SILVER | 2008 |
|
RU2367552C1 |
| SOLDER ON SILVER BASE | 2006 |
|
RU2335385C1 |
| SOLDER FOR SOLDERING JEWELS MADE FROM ALLOY OF 850-STANDARD PALLADIUM | 2010 |
|
RU2447170C1 |
| SOLDER ALLOY BASED ON PALLADIUM 850 ALLOY | 2014 |
|
RU2568406C1 |
| SOLDER ALLOY BASED ON PALLADIUM 850 SAMPLE | 2014 |
|
RU2591900C2 |
| SOLDER FOR PALLADIUM AND ITS ALLOYS | 2000 |
|
RU2176180C1 |
| SOLDER FOR PALLADIUM AND ITS ALLOYS | 2006 |
|
RU2317881C1 |
| SOLDER FOR SOLDERING METALS AND STEELS | 0 |
|
SU1763133A1 |
| SOLDER FOR SOLDERING JEWELRY ALLOYS OF PALLADIUM, 850 POINTS FINE | 2005 |
|
RU2289497C1 |
