METHOD OF ASSEMBLING AN ELECTRONIC MODULE, WHICH PROVIDES IMPROVED THERMAL AND OVERALL DIMENSIONS Russian patent published in 2016 - IPC H01L23/36 H05K7/20 

FIELD: cooling.

SUBSTANCE: invention can be used for cooling a group of heat-generating elements arranged on a printed wiring board. On each side of the base printed wiring board between heat-generating elements of a group of submodules, arranged on both sides of base printed wiring board, and the base printed wiring board there is a heat-conducting plate connected to a radiator to form electrically closed volume. Housing cover of the heat-generating elements of submodules face to heat-conducting plates, and heat-conducting gaskets are placed between the printed wiring boards of submodules and inner surface of the radiators, wherein the radiators are connected to the base printed wiring board.

EFFECT: providing efficient heat removal and minimizing design dimensions, there is no need to use forced air circulation inside the device, providing electromagnetic shielding of printed a printed wiring board with electronic components at limitations on the thickness of the device.

1 cl, 3 dwg