FIELD: power engineering.
SUBSTANCE: invention relates to the field of electronics and may be used to provide for effective heat release from printed circuit boards with electronic components placed on them. In the device comprising two plates from highly heat conductive materials the first plate is fixed on the printed circuit board with heat releasing components placed on it. At the same time the first plate is fixed on the frontal side of the printed circuit board with heat releasing components placed on it and at the side facing the heat releasing components placed on the printed circuit board is made in the form of a replica of the frontal side of the printed circuit board with heat releasing components placed on it, and the second plate from highly heat conductive materials is fixed on the back side of the printed circuit board.
EFFECT: increased efficiency of heat removal.
9 cl, 3 dwg, 1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| DEVICE FOR HEAT REMOVAL FROM FUEL COMPONENTS | 2015 |
|
RU2586620C1 |
| DEVICE FOR HEAT REMOVAL FROM HEAT-GENERATING OBJECTS | 2015 |
|
RU2602805C1 |
| DEVICE FOR HEAT REMOVAL FROM HEAT-GENERATING OBJECTS | 2018 |
|
RU2671923C1 |
| HYDROCARBON FLUID LEAKS SENSOR | 2018 |
|
RU2678920C1 |
| MULTISENSOR DETECTOR OF CRITICAL SITUATIONS | 2013 |
|
RU2536766C1 |
| ELECTROCONDUCTIVE LIQUID LEAK SENSOR | 2013 |
|
RU2545485C1 |
| DEVICE FOR HEAT REMOVAL FROM ELECTRIC RADIO ELEMENTS | 2023 |
|
RU2821282C1 |
| SYSTEM FOR HEAT REMOVAL OF MODULES OF COMPUTER SYSTEM OF HIGHWAY-MODULAR ARCHITECTURE | 2023 |
|
RU2821267C1 |
| LEAKAGE SENSOR | 2018 |
|
RU2675193C1 |
| LIQUID COOLING SYSTEM FOR MULTIPROCESSOR COMPUTATION COMPLEX, PACKAGE AND HEAT SINK MODULE | 2013 |
|
RU2522937C1 |
