SYSTEM OF CONDUCTIVE HEAT REMOVAL FROM ELECTRONIC MODULES OF STACK FORM FACTOR FOR HOUSING ELECTRONICS PRODUCTS Russian patent published in 2020 - IPC H05K7/20 

FIELD: heat exchange.

SUBSTANCE: invention relates to electronic engineering and is intended to provide removal of heat energy from heat-generating components of housing electronic components - from electronic modules made in format of stack form factor. System comprises a body equipped with aluminium parts installed on its two internal opposite walls with ribs forming a system of grooves, and at least one copper heat-removing plate. Product module with installed heat-removing plate is connected to the rest modules in stack. Stack of modules is installed in the body of the article only due to fixation of the edges of the heat-removing plate on one of the modules by lockspins in the casing slots. Heat removal to housing is carried out due to tight fit of heat-removing plate edges to housing side walls. Tight abutment is ensured by locking the plate in housing slots with locks installed on the edges of each heat-removing plate. Heat removal from the module to the plate occurs due to attachment of the plate to fuel elements of the module or to an intermediate cooling radiator. Heat is extracted by the plate and redistributed over its entire area from the module to the side walls of the housing along the entire contact area of the two edges of the plate and the housing in the slot.

EFFECT: technical result is higher efficiency of conductive heat removal from electronic modules.

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