FIELD: radio engineering.
SUBSTANCE: invention relates to radio engineering and is aimed at reducing of powerful radio components (ERP) temperature installed on surface of multilayer ceramic boards (MCP), made according to low-temperature jointly sintered multilayer ceramics technology. Achieved by fact that in MCP cooling device consisting of porous structure with set of channels, tightly embedded inside MCP and filled with heat carrier, porous structure is porous metal tape, containing internal channels and placed between upper ceramic layers. Version of cooling device is structure, in which part of porous metal tape is installed in upper ceramic layers in places of heat sinks from ERP, and remaining part is in bent state in lower ceramic layers.
EFFECT: technical result is creation of reliable and technologically simple cooling device built into MCP, based on preliminary made porous metal structure (tape) with internal channels.
3 cl, 3 dwg, 1 tbl
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