FIELD: technological processes.
SUBSTANCE: invention relates to electroplating and can be used for modification of copper galvanic coatings. Method involves introduction in sulphate of copper plating electrolyte of copper nanoparticles obtained by dispersion of copper wastes with size of 2.5–100 nm with concentration up to 0.1 g per 100 ml of electrolyte.
EFFECT: improved physical and mechanical characteristics of copper coating.
1 cl, 3 tbl, 6 dwg, 1 ex
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Authors
Dates
2017-03-02—Published
2015-07-27—Filed