FIELD: physics, computer science.
SUBSTANCE: present invention relates to the assembly on the printed circuit board. It is achieved by that, the assembly on the circuit board includes: a bottom layer; electronic components, which are divided into categories, at that, each component is attached to the bottom layer by means of fasteners, having a specified temperature of thermal tripping, depending on to which category applies the mentioned component.
EFFECT: invention provides creation of an assembly on a printed circuit board and the assembling method of such assembly on a printed circuit board, in order to facilitate separation and collection of different electronic components, mounted in an assembly on a printed circuit board, at the end of its service life, and additionally facilitating the reuse of electronic components and / or recycling of substances, from which the electronic equipment wastes consist of.
12 cl, 6 dwg
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