MICROCONTACT FOR SURFACE MOUNTING AND ARRAY OF MICROCONTACTS Russian patent published in 2020 - IPC H05K1/11 H01L23/12 H01L23/15 

FIELD: electricity.

SUBSTANCE: invention relates to implementation of interconnections when assembling electronic devices, including multi-crystal modules, micromodules, printed circuits. Technical result is achieved by the fact that microcontact for surface assembly of parts from silicon with formation of conducting interconnection contains volume elements of contacting in the form of protrusion and reciprocal recess in volume of material of mounted parts. Recess accommodates the projection partially or completely. Ledge and the recess corresponding to it are made in the form of truncated or non-inscribed cones, or pyramids with contact platforms from one or several identical, or differing conducting layers covering their surface completely or partially. Arrays of such microcontacts are proposed, which increase accuracy and reliability of assembly and ensure pumping of coolant.

EFFECT: technical result is increased accuracy of alignment during installation with increase in quality, density and speed of installation, reduced minimum distance between adjacent contacts with increase in possible degree of integration and density of installation, improved heat removal, increased mechanical strength of contact assembly, increased reliability of assembly, simplified automation of installation.

6 cl, 3 dwg