POWER SUPPLY SYSTEM AND PACKAGE STRUCTURE THEREOF Russian patent published in 2020 - IPC H01M2/08 H01M10/42 H01M10/52 

FIELD: electricity.

SUBSTANCE: invention relates to packet structure and associated power supply system. Power supply system comprises first electrode, second electrode, separation layer and flexible insulation frame. Flexible insulation frame glues the first current collector with the second current collector, wherein the flexible insulation frame comprises: two first silicone layers, where each of the first silicone layers mainly comprises a first silicone having a main chain "Si-C-C-Si-O", where the second silicone layer mainly contains a second silicone having a "Si-O-Si" main chain. Thickness of each of the first silicone layers ranges from 70 percent to 90 percent with respect to the sum of the thickness of the separating layer and the first layer of active material.

EFFECT: invention allows creating power supply system with smaller volume and weight and higher energy density.

15 cl, 14 dwg