SOLUTION FOR METAL FILM FORMATION AND FOR METAL FILM FORMATION Russian patent published in 2017 - IPC C25D21/14 

FIELD: chemistry.

SUBSTANCE: solution to form a metal film for metal ions supply to a solid electrolyte membrane during film formation is proposed. At that, during film formation, the solid electrolyte membrane is located between the anode and the substrate as the cathode and the solid electrolyte membrane is brought into contact with the substrate, and voltage is applied between the anode and the substrate for metal deposition on the substrate surface of metal ions contained in the solid electrolyte membrane, wherein the metal film is formed on the substrate surface. The solution for metal film formation comprises a solvent and a metal, dissolved to the ionic state. Concentration of film-forming metal hydrogen ions is within the range of 0 to 10^-7.85 mol/l at 25°C. The solvent is an alcohol solvent comprising at least one component selected from methanol, ethanol and propanol, or a solvent containing this alcohol solvent and water.

EFFECT: invention provides a solution for metal film formation, where hydrogen gas generation between the solid electrolyte membrane and the substrate is suppressed.

4 cl, 4 dwg