FIELD: metal industry.
SUBSTANCE: invention refers to the application of metal films to the surface of a conducting layer with a pattern created on a polymer substrate. The device for application of a metal film includes an anode, a polymer substrate with a surface, on which a conducting layer and a pattern playing the role of a cathode is created, a solid electrolyte membrane containing metal ions and located between the anode and the polymer substrate, moreover, the solid electrolyte membrane is in contact with the surface of the conducting layer with the pattern during formation of a metal film, a power unit, and an electrically-conducting component located in contact with the conducting layer with the pattern during formation of a metal film so that the negative electrode of the power unit is electrically connected to the conducting layer with the pattern, moreover, the electrically-conducting component is performed with the possibility of disconnection from the conducting layer with the pattern, whereupon, metal ions are restored for deposition of metal forming a metal film on the surface of the conducting layer with the pattern after delivery of electrical potential.
EFFECT: invention provides the possibility of formation of a metal film without formation of unnecessary conducting areas on the substrate.
8 cl, 10 dwg, 3 ex
