NICKEL FILM FORMING METHOD AND NICKEL SOLUTION USED FOR IT Russian patent published in 2019 - IPC C25D3/12 

FIELD: chemistry.

SUBSTANCE: invention relates to electroplating and can be used to form a nickel film on a metal substrate. Method comprises placing an anode, a metal cathode substrate and a solid electrolyte membrane comprising a solution which contains nickel ions and chloride ions, wherein solid electrolyte membrane is arranged between anode and metal substrate in contact with metal substrate surface, and applying an electrical voltage between the anode and the metal substrate to form a nickel film, wherein concentration of chloride ions in solution ranges from 0.002 to 0.1 mol/l and solution has pH from 2.5 to less than 4. Solution for forming a nickel film contains nickel ions and chloride ions and is intended for the method given above, wherein concentration of chloride ions in the solution ranges from 0.002 to 0.1 mol/l, and the solution has pH from 2.5 to less than 4.

EFFECT: technical result is prevention of corrosion of metal substrate.

8 cl, 5 dwg, 3 tbl, 5 ex