FIELD: building.
SUBSTANCE: cutting plate (20) has the cutting edge (26) formed at the intersection of the front surface (28) and the rear surface (30), with the chip removal device (22) located on the front surface (28). The chip removal device (22) includes a plurality of recesses (50, 74) which extend downward to the front surface (28), and a plurality of projections (52, 72) which extend upward from the front surface (28). The plurality of recesses (50, 74) follows the relief with increasing depth in the direction (DR) backward from the front area (25) of the cutting edge (26). The plurality of projections (52, 72) follows the relief with increasing height in the direction (DR) backward from the front area (25) of the cutting edge (26).
EFFECT: increasing the chip removal efficiency.
22 cl, 9 dwg
