FIELD: process engineering.
SUBSTANCE: invention relates to laser cutting with the injection of a purge gas flow to the cutting area for removing slag and gases produced during the cutting process. The purge gas injection into the cutting zone is carried out by means of gas pulse, wherein the intensity of the laser radiation reflected from the cutting zone is measured continuously, and the purge gas flow rate is regulated by changing the frequency, pressure, or both frequency and pressure of the gas pulse, depending on the measured intensity which is maintained at a predetermined minimum.
EFFECT: invention use allows to improve the quality of the cutting process.
9 cl, 8 dwg
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