FIELD: physics, instrumentation.
SUBSTANCE: invention refers to a radio electronics, namely to PCB manufacturing techniques. The essence of method for preparation of crystalline or polycrystalline substrates for plating is that the crystal or polycrystalline substrate is polished in a standard way, photoresist is applied to the substrate, which is then light-cured and etched, the photoresist is coated by a mask and active metal to remove the charge, embedded dislocations are created, for which the selected metal is treated by an ion flow from the ion accelerator, and, after substrate activation the mask and the active metal are washed away by a liquid substance which does not react with the activating metal.
EFFECT: expansion of the arsenal of technical tools for preparation of crystalline or polycrystalline substrates for plating.
1 dwg
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