CERAMICS METALLIZATION METHOD Russian patent published in 2023 - IPC C04B41/88 C04B41/91 

FIELD: metallurgy.

SUBSTANCE: invention relates to the field of production of metal surfaces on ceramic products; it can be used in electronic, electrical engineering, and radio engineering industries in the production of metallized substrates for hybrid integrated circuits (HIC), power modules, powerful transistor cases, and light-emitting diodes, as well as microcircuit cases for flat mounting on printed circuit boards. A ceramics metallization process includes irradiation with a laser of a section of a sintered ceramics surface based on metal oxide or metal nitride, or metal carbide, removal of part of ceramic material, formation of protrusions adjacent to irradiated sections of the ceramics surface, and metallization of protrusions. Protrusions are made elevated relatively to sections of the ceramics surface, irradiated with the laser, while a protrusion height is 0.1-0.3 mm. Metallization paste is applied to the surface of elevated protrusions after oxidative calcination in hydrogen in water steams, then, metallization burning is carried out, and a nickel layer is precipitated. A thickness of the metallization layer is 1/3-1/10 of the protrusion height.

EFFECT: simplification of a ceramics metallization process, provision of locality of application of a metallization layer, while saving adhesion and integrity of the metallization layer.

3 cl, 4 ex, 5 dwg