MANUFACTURING METHOD OF LAYER-TO-LAYER TRANSFER BETWEEN THE PRINTED CONDUCTORS ON THE CRYSTALLINE OR POLYCRYSTALLINE SUBSTRATE Russian patent published in 2017 - IPC H05K3/42 

FIELD: radio engineering, communication.

SUBSTANCE: in the manufacturing method of the layer-to-layer transfer between the printed conductors on the crystalline or polycrystalline substrate, the substrate with via holes is taken, mask its surfaces by means of the photoresist, excepting the rings around the transition surfaces. The substrate is located in the implanter, it is exposed by the metal ions flow with simultaneous rotation about the axis perpendicular to the substrate plane. The substrate is placed at the angle to the ions flow, providing its best entry into the via holes. The workpiece is removed from the implanter, turned, and repositioned in the implantor, and repeat the exposure from the other side. Remove the workpiece from the implanter and apply the galvanic copper by the standard way.

EFFECT: creation of the manufacturing method of the layer-to-layer transfer between the printing conductors on the crystalline or polycrystalline substrate, improving the adhesion by changing the properties of the crystal.

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