FIELD: metallurgy.
SUBSTANCE: method of tin recovery from waste of electronic and electrical industries involves dissolving tin-containing solder on printed circuit boards at a temperature of 70-90°C with a solution of methanesulfonic acid adding an oxidizer. Further, the metastannic acid is coagulated from the resulting suspension in the presence of a coagulant at constant stirring and the separation of the tin-containing precipitate. As the coagulant, the stillage bottoms of hydroxyethylation of synthetic fatty acids of fraction C10-C22 are used. Prior to dissolving, the printed boards are heat-treated at the melting temperature of the tin solder.
EFFECT: improved efficiency of the tin recovery and yield of the finished product.
4 cl; 1 ex
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SU1759587A1 |
