FIELD: technological processes.
SUBSTANCE: mechanical removal of add-on parts from the used electronic boards is made getting the first intermediate product from the removed add-on parts and lightweight boards with mounting and micromounting parts; the said lightweight boards with mounting and micromounting parts are separated in the first trommele from the said first intermediate product; chemical dissolution of solder is made in the activator from the said lightweight boards to form a suspension of the dissolved solder and a solid phase from the mounting and micromounting parts and plastic boards bases; the dissolved solder suspension is separated in the second trommele from the said solid phase, the said solid phase is divided on the said plastic boards bases and elements containing noble metals; and the divided elements are transfered to take out thereof the respective noble metals; the plastic boards bases are sent to recycling. The invention covers also the system for the processing of electronic boards.
EFFECT: increase in metal extraction during continuous processing of the used electronic boards.
20 cl, 2 dwg
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Authors
Dates
2017-02-08—Published
2014-12-18—Filed