HEAT TRANSFER BAY Russian patent published in 2017 - IPC F28D15/02 

FIELD: heating system.

SUBSTANCE: heat transfer bay comprises: two wafers and a frame that links two wafers. Two wafers and a frame form a platelike hollow bord; a capillary structure coating that is attached close to the chamber liner; and a chambered processing medium with the phase transfer. A frontier area part of one of the two wafers or a frame part work as a heat transfer bay evaporation zone and the other part of the bord work as a heat transfer bay condensation zone. The heat transfer bay has a greaten steam passage area, walkway clearance for the fluide medium reverse flow and heat passage area of the condensation zone and a decreased center-to- evaporation-zone-edge distance.

EFFECT: heat transfer ability and heat flow rate increase.

5 cl, 11 dwg