FIELD: electricity.
SUBSTANCE: invention relates to a disc cell (1) for pressed contact of several semiconductor elements by means of clamping means (4, 13), which create a clamping force (F), including: a housing (2, 3, 7, 8); at least one first semiconductor element (6) of the first design type installed in the housing; at least one second semiconductor element (5) of the second type, different from the first, installed in the housing. The housing (2, 3, 7, 8) includes at least one metal pressure plate (2) for clamping the first and second semiconductor element and covering the first (6) and second (5) semiconductor elements, oriented at a substantially right angle to the clamping force (F). The pressure plate (2) is designed in such a way that the clamping force (F) acts on it with a local constraint (9) for clamping the first (6) and second (5) semiconductor element by the pressure plate (2). The first semiconductor element (6) is located under the local clamping force (F) impact area (9), and the second semiconductor element (5) is located at least partially outside the local impact area (9).
EFFECT: invention provides a high degree of integration and simplification of the adjustment of the clamping.
17 cl, 3 dwg
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Authors
Dates
2018-01-24—Published
2015-02-17—Filed