MODULE OF POWER SEMICONDUCTOR ELEMENT WITH RESERVOIR FORMING PRESSURE PLATE Russian patent published in 2019 - IPC H01L23/367 

FIELD: electricity.

SUBSTANCE: invention can be used to create a power semiconductor element. Essence of invention consists in the fact that module of power semiconductor element for fixation on cooling body includes: at least one power semiconductor element; contacting means to electrically contact with said at least one power semiconductor element; made in at least separate areas of heat conducting clamping plate; prestressing means, which are designed to pre-strain the contacting means to the power semiconductor element for electrical contact, and power semiconductor element to said at least one heat-conducting region of said heat-conducting clamping plate made in at least separate regions in direction of cooling body for thermal contact; fastening means for securing the prestressing means on the cooling body, wherein the fasteners include the heat-conducting clamping plate made in at least separate regions, wherein said at least in separate areas the heat-conducting clamping plate forms at least one reservoir surrounding the power semiconductor, the filling mass is placed in the reservoir.

EFFECT: technical result: possibility of easy filling of module with filling mass.

11 cl, 5 dwg