FIELD: physics.
SUBSTANCE: method includes the formation of strokes of a given frequency, with the geometrical parameters in the cross section close to the set parameters of strokes of the diffraction grid, in a layer of the plastic material on the polished substrate, and the removal of the layer of the plastic material via a reactive ion-beam etching, the strokes formed in the layer of the plastic material are used as a technological strokes that are formed with a slope angle of the sloping faces to the surface of the substrate, equal to 3°-12°, and completely removed by reactive ion-beam etching under an angle of 90° to the surface of the substrate while the substrate in the formation of strokes with a set angle of "shine" and with the set period of the grid. The material of the technological strokes is a material the etching rate of which is higher than the etching rate of the substrate material.
EFFECT: ensuring the possibility of improving the production quality of the diffraction grids.
3 cl, 3 dwg
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Authors
Dates
2018-01-24—Published
2016-12-27—Filed