FIELD: manufacturing technology.
SUBSTANCE: invention relates to a method of manufacturing a composite structure comprising the following steps: a) obtaining donor substrate (50) and carrier substrate (10); b) the formation of dielectric layer (30); c) formation of covering layer (20); d) formation of weakened zone (60) in donor substrate (50); e) connecting carrier substrate (10) and donor substrate (50) by means of contact surface (70) having contour (Cs); f) donor substrate (50) fracture along weakened zone (60); and steps b) and e) are performed so that the contour (Cz) is inscribed in the contour (Cs), and step c) is performed so that cover layer (20) covers the peripheral surface of dielectric layer (30).
EFFECT: proposed method for manufacturing the composite structure makes it possible to perform the step of plastic deformation of the working layer so as to cover the exposed surface of the cover layer and the dielectric layer.
17 cl, 6 dwg
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Authors
Dates
2018-02-28—Published
2014-03-21—Filed