FIELD: radio electronics.
SUBSTANCE: invention relates to radio electronics and can be used in manufacture of LED increased power sources. Method includes: preliminary in proposed locations of components on board, holes are made, performing functions of template and radiation output window, LEDs are installed in holes in such a way that radiation is directed into hole of printed circuit board, and terminals of LEDs, located on housing upper surface are connected to pads, formed at holes edges on board. Further, printed circuit board with LEDs is installed by contact areas for heat sink on radiator or luminaire housing.
EFFECT: method according to invention makes it possible to increase power of heat sink from LEDs installed on various printed circuit boards while maintaining possibility and advantages of surface mounting components.
1 cl, 3 dwg, 1 ex
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