FIELD: microstructure technology.
SUBSTANCE: use: to create a micromechanical component. Summary of the invention consists in that the microelectromechanical component manufacturing method includes the stage of the first layer composite manufacturing comprising a structured layer, which is electrically conductive in at least a first section, and a groove filled with an insulating material, which passes outward from the structured layer first surface and is located on the structured layer first section, wherein the structured layer first surface is facing the first layer composite first surface, second layer composite manufacturing stage having a first recess on the second layer composite first surface, stage of the first layer composite connecting with the second layer composite with abutment of the first layer composite first surface to the second layer composite first surface on at least some sections and the filled groove placing within the first recess lateral position, after the first layer composite (10) connection to the second layer composite (20), reducing the first layer composite (10) thickness from the first layer composite (10) second surface (112) to the depth of the filled groove (15), wherein the first layer composite (10) second surface (112) is positioned opposite the first layer composite (10) first surface (110), and the stage of the component (1) active structure (17) in the structured layer (11) manufacturing, wherein the active structure (17) is located within the first recess (210) lateral position and comprises the structured layer two second sections (115), which are located on the structured layer first section, are rigidly physically connected to each other and electrically isolated from each other by filled grooves; before the first layer composite connection to the second layer composite, the filled groove in the first layer composite passes to a depth, which is less than the thickness of the first layer composite; the first layer composite further comprises an auxiliary layer, adjacent to the structured layer second surface, wherein the structured layer second surface is located opposite to the structured layer first surface and the filled groove passes to the structured layer second surface.
EFFECT: technical result is provision of the possibility of creating of a micromechanical component with two separate parts, which are rigidly mechanically connected to each other but completely isolated from each other.
9 cl, 12 dwg
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Authors
Dates
2018-04-26—Published
2015-02-11—Filed