FIELD: electricity.
SUBSTANCE: group of inventions relates to semiconductor lasers. Cooling device (100) comprises a mounting area for the laser arrangement, cooling volume (140) comprising cooling channels being arranged to cool mounting area (105), coolant inlet (150) and coolant outlet (145) being connected to the cooling channels of cooling volume (140), first coolant supply through hole (110) being connected to coolant inlet (150), second coolant supply through hole (111) being connected to coolant outlet (145). Cooling device (100) further comprises at least one coupling element (115, 130, 135) enabling the detachable interconnection to second cooling device (100), such that upon interconnecting cooling device (100) to second cooling device (100), first coolant supply through hole (110) of cooling device (100) is connected to a first coolant supply through hole of second cooling device (100) and second coolant supply through hole (111) of cooling device (100) is connected to a second coolant supply through hole of second cooling device (100), wherein cooling device (100) is arranged in a way that a coolant can be supplied to cooling volume (140) via first coolant supply through hole (110) of the cooling device (100) and second coolant supply through hole (111).
EFFECT: technical result is simpler scaling of a laser system.
15 cl, 13 dwg
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Authors
Dates
2018-06-08—Published
2014-04-30—Filed