FIELD: electronic equipment.
SUBSTANCE: invention relates to microelectronics technology, namely to the manufacture of microelectronics products containing a "polyimide film-metal" glue adhesion compound in the construction. In particular, the treatment of a polyimide film in the flare of a nonequilibrium heterogeneous low-temperature microwave plasma at atmospheric pressure using a mixture of argon and oxygen as a buffer gas has been proposed, and relative motion of the film and plasma flame at a repetition rate of excitation pulses of not less than 50 Hz and the pulse ration of 2.6–2.85. Consumed power of the microwave plasma generator is not more than 500 W. Plasma torch has a cylindrical shape. Processing speed is from 10 to 100 mm/s.
EFFECT: as a result, without a preliminary mechanical and chemical treatment of the polyimide film, it is possible to create a reproducible surface for the formation of the "polyimide-metal" adhesive compound.
4 cl, 8 dwg, 1 tbl
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Authors
Dates
2018-06-18—Published
2017-02-07—Filed