FIELD: technological processes.
SUBSTANCE: disclosed is a device for binding two substrates comprising a first roller, a second roller, which forms a gap with the first roller, a substrate carrier configured to simultaneously move the first substrate and the second substrate through the gap, and an electronic control device. Electronic control device controls the carrier for simultaneously moving the first substrate and the second substrate through the gap with a hydrophobic material pattern located on the first side of the first substrate interacting with the first side of the second substrate. First substrate interacts with the first roller which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together.
EFFECT: system and method of forming bound substrates are disclosed.
15 cl, 7 dwg
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