FIELD: measuring equipment.
SUBSTANCE: invention relates to measurement equipment, namely to non-destructive testing, and can be used for measurement of thermal parameters of semiconductor devices after fabrication and installation on cooling radiator. Device for measuring thermal resistance between housing of semiconductor device and cooling radiator comprises microcontroller connected to optical emitter, which is optically connected to optical receiver, which output is connected to microcontroller input, which is connected to computer. Housing of the controlled semiconductor device through the heat-conducting paste layer is attached to the cooling radiator, which is placed in the container filled with dielectric liquid so that the lower part of the cooling radiator is submerged into the dielectric liquid, and the housing of the semiconductor device is located above its level. Cooling radiator is located between optical radiator and optical receiver, which are attached from inside container to its opposite walls above level of dielectric liquid so that their optical axes coincide and directed towards each other. Vessel is installed on the heater. Amplifier is connected to the housing of the semiconductor device and to the cooling radiator, which is connected to an analogue-to-digital converter which is connected to the microcontroller.
EFFECT: possibility of measuring thermal resistance between housing of any semiconductor device and radiator of its cooling after installation of semiconductor device on radiator, which provides information on the presence and quality of heat-conducting paste application between the semiconductor device and the cooling radiator without removal of the radiator before the semiconductor device is put into operation.
1 cl, 1 dwg
