POTENTIAL-FREE POWER MODULE HOUSING Russian patent published in 2020 - IPC H01L23/10 H01L23/52 

FIELD: electronics.

SUBSTANCE: invention relates to power electronics, particularly to converters with reduced dynamic losses in power semiconductor switches, half-bridge drivers, self-contained current inverters, and so forth. In potential-free half-bridge power module housing containing flange from pseudoalloy to which ceramic plate for mounting of module functional elements is soldered, soldered rim for housing sealing, external terminals are soldered to contact pads connected to contact pads located in inner cavity of housing through metallized transition holes in ceramics, on the flange there is a base of pseudoalloy with external dimensions corresponding to the rim sizes for the housing sealing, in the base there are two cuts on opposite sides for output from the terminals housing, wherein width of jumper between slots exceeds flange width, in points of slots high-temperature solder is vacuum-tightly soldered to boards from alumina ceramic with transition metallized holes, to the contact pads of which the terminals are soldered, and the casing sealing ring and the mounting plate from the high-heat conducting ceramic are soldered to the base.

EFFECT: invention provides a significant increase in the yield of fit bodies in production and increase in their operational reliability.

1 cl, 5 dwg, 1 tbl