FIELD: technological processes.
SUBSTANCE: invention is related to microelectronics and may be used in production of three-dimensional hybrid integral module, comprising flexible board with mounted crystals of naked chips. In method for manufacture of three-dimensional hybrid integral module flexible board is made, besides at design stage all areas for bends are designed as branch fragments. When making assembly operations, branch fragments are coated with protective shock-absorbing adhesive coating along the whole length of bend semi-circle. Remaining parts of board are coated with thermal compensating coat, afterwards flexible board is folded in stack so that assembly terminals are located symmetrically relative to stack.
EFFECT: improved reliability of hybrid integral module.
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