FIELD: electronic means.
SUBSTANCE: method for the production of multi-chip modules and microassemblies based on switching substrates with unpackaged microchips and passive components. The technical result is achieved through the simultaneous use of unpackaged microchips and passive components, the use of a modular principle for assembling individual functional units, sealing the assembly with a compound with a low temperature coefficient of linear expansion and high thermal conductivity based on a phosphazene modified dianic resin, and placing interlevel switching on the sides of the microassembly using the chemical and electrochemical deposition of a conductive metal directly on the surface of the compound, without the use of vacuum processes for the formation of adhesive layers of metallization.
EFFECT: increasing the density of vertical switching, the efficiency of distribution and removal of heat from electronic components of various microassembly designs at reduced production costs.
1 cl, 6 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| METHODS FOR MANUFACTURING THREE-DIMENSIONAL ELECTRONIC MODULES, THREE-DIMENSIONAL ELECTRONIC MODULES | 2018 |
|
RU2705727C1 |
| METHOD OF ELECTRICAL AND MECHANICAL CONNECTION OF BOARDS AND INTERPOSERS IN 3D ELECTRONIC ASSEMBLIES | 2019 |
|
RU2703831C1 |
| METHOD OF MANUFACTURING MICROELECTRONIC UNIT | 2016 |
|
RU2645151C1 |
| MICROELECTRONIC COMPONENTS MOUNTING METHOD | 2015 |
|
RU2571880C1 |
| METHOD FOR MANUFACTURING HYBRID ELECTRONIC MODULE | 2002 |
|
RU2222074C1 |
| METHOD OF MANUFACTURING MICROELECTRONIC NODE | 2016 |
|
RU2651543C1 |
| METHOD OF MAKING ELECTRONIC ASSEMBLIES ON FLEXIBLE SUPPORT WITHOUT SOLDERING AND WELDING PROCESSES | 2014 |
|
RU2572588C1 |
| MULTICHIP MODULE | 2019 |
|
RU2702705C1 |
| METHOD OF ASSEMBLING THREE-DIMENSIONAL ELECTRONIC MODULE | 2012 |
|
RU2492549C1 |
| METHOD FOR MANUFACTURING THREE-DIMENSIONAL MULTICOMPONENT ELECTRONIC MODULE | 2001 |
|
RU2193260C1 |
